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HOME
ABOUT US
Return
Company Profile
Corporate Culture
News
PRODUCT SERIES
Return
Product series
Packaging cases
TECHNICAL SERVICES
Return
IC Packaging Design and Simulation Services
2.5D/3D Packaging Structure Design
Ceramic Chiplet Business
APPLICATIONS
Return
Automotive
Big data storage and computing
Artificial intelligence
Signal communication
Radar
INVESTOR RELATIONS
Return
Financial Summary
Various Announcements
JOIN US
CONTACT US
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产品系列
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Packaging cases
Packaging cases
Printer chip
Optical sensors
Microphone sensor
Audio processor
Internet of Things(loT)Equipment
Fingerprint sensor