通信 COMMUNICATION In the 5G era, the characteristics of high frequency, high speed, low latency, and multi-path bring new technological challenges to integrated circuit packaging. We provide a full range of advanced packaging and testing solutions, including 2.5D/3D packaging, wafer level packaging, system level packaging (SiP), etc., to provide customers with complete chip manufacturing solutions for the communication field. In the field of system level packaging, while actively developing 2.5D/3D packaging technology, we also focus on developing SiP module technology for heterogeneous integration. | 
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 | RF Co-Design & Simulation | | High-Speed EMI Shielding | | Low-Dk/Df BOM Selection | | Turnkey 5G Testing Service |
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HChiplet Semiconductor (Shaoxing) Co.,Ltd. as an advanced packaging supplier, was established in 2023. It is a technology-driven high-tech company mainly engaged in chiplet chip packaging.
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