HChiplet Semiconductor (Shaoxing) Co.,Ltd. established in 2023, is a technology-driven high-tech company mainly engaged in chiplet chip packaging as an advanced packaging supplier. The company's factory and R & D center are located in Keqiao District, Shaoxing City, a famous historical and cultural city with a long history, numerous celebrities, beautiful scenery, and a developed economy. Shaoxing is known as the "Jiangnan Water Town" and the "Oriental Venice". The location of the company is adjacent to Xiaoshan District, Hangzhou. There is a subway directly leading to Hangzhou. It is only 22 kilometers away from Hangzhou Xiaoshan International Airport, with a 30-minute drive, only 8.8 kilometers / 15-minute drive from Shaoxing North High-Speed Railway Station, and only 40 kilometers away from the West Lake in Hangzhou, with a one-hour drive. | 
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| 2023 | 30 a hundred million | 80 Mu | 200 Ten thousand pieces |
| Establishment time | Total investment | Total land use | It is planned to build a new large-size AI chip with an annual output |
Company Goal:
Business direction of the company:
Main business of the company:
◼ Main Business: Design of chip packaging solutions and contract manufacturing services + industrial-grade Chiplet modules.
◼ Company Positioning: A global advanced packaging solution service provider with full-process design and simulation capabilities, aiming to become a provider of highly reliable and high-performance industrial modules.
◼ Main Products: Advanced packaging such as Chiplet, fcBGA, fcCSP, LGA; industrial-grade Chiplet modules.
◼ Target Market: Relying on the internationally leading Chiplet, FC and Chiplet advanced packaging technologies, it can achieve chip-level to system-level packaging for HPC chips (CPU/GPU/NPU/DPU, etc.), AI chips, image sensor chips, biometric chips, high-performance ceramic packaged chips, microsystem power modules, Internet of Things modules, etc.
Team background:
The team has gathered a group of R & D and technical experts from international top packaging and testing enterprises, national and provincial enterprise technology centers, 3D packaging engineering technology research centers, microelectronics engineering technology research centers, and the implementation of the 02 Special Project, as well as advanced packaging technology and chip back-end packaging design and simulation engineers. The core members have over 20 years of experience in factory operation and management control. The product line covers various packaging materials that are currently in mass production and under research and development by mainstream semiconductor material manufacturers at home and abroad.
Talent system:HChiplet Semiconductor has established a systematic and scientific training system to help employees formulate comprehensive training and career development plans. In the first phase of the plan, the company aims to build a R & D team with more than 50 people, forming a talent echelon model led by core R & D leaders, dominated by senior engineers, and implemented by key engineers for development. The educational background ratio will reach an optimized structure of 1:4:5 (Doctorate: Master's Degree: Bachelor's Degree).
Advanced Packaging Research Institute:The Advanced Research Institute of Qili Semiconductor relies on more than thirteen years of research and experience accumulation in advanced packaging materials, as well as over eighteen years of experience in the accumulation and calibration of simulation models. It realizes the reliability of production and manufacturing through the standard processes of design, simulation, research and development, and mass production, ensures the yield rate, and explores new materials to save costs for customers, improve quality, and reduce energy consumption.
Company Development History
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2013
An innovative semiconductor service enterprise composed of a group of elites from the semiconductor industry such as ASE, Huatian, Changdian, Tongfu Microelectronics, STMicroelectronics, and Xingsen Technology.
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2013~2017
It is committed to providing fast and first - class integrated circuit design, simulation, packaging, processing and testing services for large, medium - sized and small semiconductor enterprises and hardware manufacturers around the world, and contributing its own strength to the development of China's semiconductor industry.
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2017~2020
The company has more than 40 customers in China, including military research institutes, scientific research institutions, and high-tech companies.
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2020~2024
It provides nearly 60 services related to the design, processing, packaging and testing of integrated circuit packaging solutions every year, winning high recognition from a wide range of customers.
HChiplet Semiconductor (Shaoxing) Co.,Ltd. as an advanced packaging supplier, was established in 2023. It is a technology-driven high-tech company mainly engaged in chiplet chip packaging.
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