Corporate Vision
Become a globally advanced packaging enterprise that is technology-driven and leads innovation!
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Corporate Mission
Go all out to overcome the technical shortcomings in the domestic advanced Chiplet packaging field, including issues such as data integrity and process maturity. Be committed to breaking the overseas technology monopoly, localize the cutting - edge technology, and contribute to the development of China's semiconductor industry.
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Corporate Values
Work in unison: With unified goals, being of one heart and one mind, through teamwork, achieving growth and a win-win situation.
Innovative collaboration: Taking technological innovation as the core driving force for enterprise development. Be down-to-earth and dutiful: Being self-aware and self-disciplined, with a down-to-earth attitude. Achieve goodness: Realizing green, environmentally friendly and sustainable development through technology, and jointly creating a beautiful future for mankind. Win-win cooperation: Building a community of interests with a win-win situation for employees, customers, and partners, and creating value for society. |
Prospect Chapter: The Rise of a Great Power and a Hundred - Million - Dollar Market
China has currently become the largest semiconductor device market in the world. The continuous high - speed growth of domestic market demand is the direct driving factor for the development of China's semiconductor industry. In the next few years, thanks to the impetus from fields such as network communication, mobile terminals, high - performance computing, automotive electronics, big data storage, artificial intelligence and the Internet of Things, and industrial intelligent manufacturing, the Chinese semiconductor market will maintain rapid growth. Especially in the field of large - size, high - computing - power AI chips, advanced packaging processes such as wafer - level + SiP + fan - out 2.5D/3D packaging will be widely used. Heterogeneous integration technology is expected to become the core force driving technological innovation in the next decade. According to DIGITMES' prediction, heterogeneous integration will drive the semiconductor industry to achieve an explosive output value of 1.2 trillion US dollars in 2035. Qili Semiconductor stands at the forefront, embracing the opportunities and challenges brought by emerging technologies, and achieving production breakthroughs and technological innovations for its customers.
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HChiplet Semiconductor (Shaoxing) Co.,Ltd. as an advanced packaging supplier, was established in 2023. It is a technology-driven high-tech company mainly engaged in chiplet chip packaging.
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